EPC2019ENG
EPC2019ENG
Part Number:
EPC2019ENG
Manufacturer:
EPC
Description:
TRANS GAN 200V 8.5A BUMPED DIE
Lead Free Status / RoHS Status:
Lead free / RoHS Compliant
Available Quantity:
14360 Pieces
Data sheet:
EPC2019ENG.pdf

Introduction

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Specifications

Vgs(th) (Max) @ Id:2.5V @ 1.5mA
Technology:GaNFET (Gallium Nitride)
Supplier Device Package:Die
Series:eGaN®
Rds On (Max) @ Id, Vgs:50 mOhm @ 7A, 5V
Power Dissipation (Max):-
Packaging:Tape & Reel (TR)
Package / Case:Die
Other Names:917-1055-2
Operating Temperature:-40°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Moisture Sensitivity Level (MSL):1 (Unlimited)
Manufacturer Part Number:EPC2019ENG
Input Capacitance (Ciss) (Max) @ Vds:270pF @ 100V
Gate Charge (Qg) (Max) @ Vgs:2.5nC @ 5V
FET Type:N-Channel
FET Feature:-
Expanded Description:N-Channel 200V 8.5A (Ta) Surface Mount Die
Drain to Source Voltage (Vdss):200V
Description:TRANS GAN 200V 8.5A BUMPED DIE
Current - Continuous Drain (Id) @ 25°C:8.5A (Ta)
Email:[email protected]

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