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EPC2010CENGR
- Part Number:
- EPC2010CENGR
- Manufacturer:
- EPC
- Description:
- TRANS GAN 200V 22A BUMPED DIE
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17953 Pieces
- Data sheet:
- EPC2010CENGR.pdf
Introduction
Specifications
| Vgs(th) (Max) @ Id: | 2.5V @ 3mA |
|---|---|
| Technology: | GaNFET (Gallium Nitride) |
| Supplier Device Package: | Die Outline (7-Solder Bar) |
| Series: | eGaN® |
| Rds On (Max) @ Id, Vgs: | 25 mOhm @ 12A, 5V |
| Power Dissipation (Max): | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | Die |
| Other Names: | 917-EPC2010CENGRTR |
| Operating Temperature: | -40°C ~ 150°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | EPC2010CENGR |
| Input Capacitance (Ciss) (Max) @ Vds: | 380pF @ 100V |
| Gate Charge (Qg) (Max) @ Vgs: | 3.7nC @ 5V |
| FET Type: | N-Channel |
| FET Feature: | - |
| Expanded Description: | N-Channel 200V 22A (Ta) Surface Mount Die Outline (7-Solder Bar) |
| Drain to Source Voltage (Vdss): | 200V |
| Description: | TRANS GAN 200V 22A BUMPED DIE |
| Current - Continuous Drain (Id) @ 25°C: | 22A (Ta) |
| Email: | [email protected] |
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