EPC2015CENGR
EPC2015CENGR
Part Number:
EPC2015CENGR
Manufacturer:
EPC
Description:
TRANS GAN 40V 36A BUMPED DIE
Lead Free Status / RoHS Status:
Lead free / RoHS Compliant
Available Quantity:
14855 Pieces
Data sheet:
EPC2015CENGR.pdf

Introduction

BYCHIPS is the stocking distributor for EPC2015CENGR, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for EPC2015CENGR by email, we will give you a best price according your plan.
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Specifications

Vgs(th) (Max) @ Id:2.5V @ 9mA
Vgs (Max):+6V, -4V
Technology:GaNFET (Gallium Nitride)
Supplier Device Package:Die Outline (11-Solder Bar)
Series:eGaN®
Rds On (Max) @ Id, Vgs:4 mOhm @ 33A, 5V
Power Dissipation (Max):-
Packaging:Tape & Reel (TR)
Package / Case:Die
Other Names:917-EPC2015CENGRTR
Operating Temperature:-40°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Moisture Sensitivity Level (MSL):1 (Unlimited)
Manufacturer Part Number:EPC2015CENGR
Input Capacitance (Ciss) (Max) @ Vds:1000pF @ 20V
Gate Charge (Qg) (Max) @ Vgs:8.7nC @ 5V
FET Type:N-Channel
FET Feature:-
Expanded Description:N-Channel 40V 36A (Ta) Surface Mount Die Outline (11-Solder Bar)
Drive Voltage (Max Rds On, Min Rds On):5V
Drain to Source Voltage (Vdss):40V
Description:TRANS GAN 40V 36A BUMPED DIE
Current - Continuous Drain (Id) @ 25°C:36A (Ta)
Email:[email protected]

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