BYCHIPS is the stocking distributor for TLK2711HFG/EM, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for TLK2711HFG/EM by email, we will give you a best price according your plan.
Buy TLK2711HFG/EM with BYCHPS
Buy with guarantee
TLK2711HFG/EM
- Part Number:
- TLK2711HFG/EM
- Manufacturer:
- Description:
- IC TXRX 1.6-2.5GBPS 68CFP
- Lead Free Status / RoHS Status:
- Not applicable / Not applicable
- Available Quantity:
- 12341 Pieces
- Data sheet:
- TLK2711HFG/EM.pdf
Introduction
Specifications
| Voltage - Supply: | 2.3 V ~ 2.7 V |
|---|---|
| Type: | Transceiver |
| Supplier Device Package: | - |
| Series: | - |
| Protocol: | - |
| Packaging: | - |
| Package / Case: | - |
| Operating Temperature: | -40°C ~ 85°C |
| Number of Drivers/Receivers: | 16/16 |
| Mounting Type: | - |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | TLK2711HFG/EM |
| Expanded Description: | 16/16 Transceiver |
| Duplex: | - |
| Description: | IC TXRX 1.6-2.5GBPS 68CFP |
| Data Rate: | - |
| Email: | [email protected] |
Related parts for TLK2711HFG/EM
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
|
TLK2711JRZQE | Texas Instruments | IC GBPS TXRX 1.6-2.7GBPS 80-BGA | Inquiry |
|
TLK2711IRCPG4 | Texas Instruments | IC XCVR 1.6-2.7 GBPS 64-HVQFP | Inquiry |
|
TLK2711AIRCPR | Texas Instruments | IC TXRX 1.6-2.7GBPS 64-HVQFP | Inquiry |
|
TLK2711IRCP | Texas Instruments | IC XCVR 1.6-2.7 GBPS 64-HVQFP | Inquiry |
|
TLK2701IRCPG4 | Texas Instruments | IC TRNSCVR 1.5-2.5GBPS 64HVQFP | Inquiry |
|
TLK2711AJRZQE | Texas Instruments | IC TXRX 1.6-2.7GBPS 80-BGA | Inquiry |
|
TLK2711JRGQE | Texas Instruments | IC XCVR 1.6-2.7 GBPS 80-BGA | Inquiry |
|
TLK2711AIRCP | Texas Instruments | IC TXRX 1.6-2.7GBPS 64-HVQFP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers