BYCHIPS is the stocking distributor for TLK2711AIRCP, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for TLK2711AIRCP by email, we will give you a best price according your plan.
Buy TLK2711AIRCP with BYCHPS
Buy with guarantee
TLK2711AIRCP
- Part Number:
- TLK2711AIRCP
- Manufacturer:
- Description:
- IC TXRX 1.6-2.7GBPS 64-HVQFP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14887 Pieces
- Data sheet:
- TLK2711AIRCP.pdf
Introduction
Specifications
| Voltage - Supply: | 2.3 V ~ 2.7 V |
|---|---|
| Type: | Transceiver |
| Supplier Device Package: | 64-HVQFP |
| Series: | - |
| Protocol: | - |
| Packaging: | Tray |
| Package / Case: | 64-VFQFP Exposed Pad |
| Other Names: | 296-23681 TLK2711AIRCPG4 TLK2711AIRCPG4-ND |
| Operating Temperature: | -40°C ~ 85°C |
| Number of Drivers/Receivers: | 16/16 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Part Number: | TLK2711AIRCP |
| Expanded Description: | 16/16 Transceiver 64-HVQFP |
| Duplex: | - |
| Description: | IC TXRX 1.6-2.7GBPS 64-HVQFP |
| Data Rate: | - |
| Email: | [email protected] |
Related parts for TLK2711AIRCP
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
|
TLK2711IRCP | Texas Instruments | IC XCVR 1.6-2.7 GBPS 64-HVQFP | Inquiry |
|
TLK2711HFG/EM | Texas Instruments | IC TXRX 1.6-2.5GBPS 68CFP | Inquiry |
|
TLK2711IRCPG4 | Texas Instruments | IC XCVR 1.6-2.7 GBPS 64-HVQFP | Inquiry |
|
TLK2711AIRCPR | Texas Instruments | IC TXRX 1.6-2.7GBPS 64-HVQFP | Inquiry |
|
TLK2711JRGQE | Texas Instruments | IC XCVR 1.6-2.7 GBPS 80-BGA | Inquiry |
|
TLK2701IRCPG4 | Texas Instruments | IC TRNSCVR 1.5-2.5GBPS 64HVQFP | Inquiry |
|
TLK2711AJRZQE | Texas Instruments | IC TXRX 1.6-2.7GBPS 80-BGA | Inquiry |
|
TLK2711JRZQE | Texas Instruments | IC GBPS TXRX 1.6-2.7GBPS 80-BGA | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers