BYCHIPS is the stocking distributor for SCCR12B105SRB, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for SCCR12B105SRB by email, we will give you a best price according your plan.
Buy SCCR12B105SRB with BYCHPS
Buy with guarantee
SCCR12B105SRB
- Part Number:
- SCCR12B105SRB
- Manufacturer:
- AVX Corporation
- Description:
- CAPACITOR 1F 2.7V THRU HOLE
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14836 Pieces
- Data sheet:
- SCCR12B105SRB.pdf
Introduction
Specifications
| Voltage - Rated: | 2.7V |
|---|---|
| Tolerance: | -10%, +30% |
| Termination: | PC Pins |
| Size / Dimension: | 0.315" Dia (8.00mm) |
| Series: | SCC |
| Packaging: | Bulk |
| Package / Case: | Radial, Can |
| Other Names: | 478-10010 |
| Operating Temperature: | -40°C ~ 65°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 3 Weeks |
| Manufacturer Part Number: | SCCR12B105SRB |
| Lifetime @ Temp.: | 1000 Hrs @ 60°C |
| Lead Spacing: | 0.138" (3.50mm) |
| Height - Seated (Max): | 0.551" (14.00mm) |
| Expanded Description: | 1F -10%, +30%(EDLC) Supercapacitor 2.7V Radial, Can 150 mOhm @ 1MHz 1000 Hrs @ 60°C |
| ESR (Equivalent Series Resistance): | 150 mOhm @ 1MHz |
| Description: | CAPACITOR 1F 2.7V THRU HOLE |
| Capacitance: | 1F |
| Email: | [email protected] |
Related parts for SCCR12B105SRB
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
FM0H473ZF | KEMET | CAPACITOR 0.047F 5.5V RADIAL | Inquiry |
 |
SCCR16B205SRB | AVX Corporation | CAPACITOR 2F 2.7V THRU HOLE | Inquiry |
 |
PAS614L-VL3 | Taiyo Yuden | CAP PAS COIN-TYPE 3.3V 10UAH 0.0 | Inquiry |
 |
BMOD0063 P125 B08 | Maxwell Technologies Inc. | CAP 63F 125V CHASSIS MOUNT | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers