BYCHIPS is the stocking distributor for PAS614L-VL3, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for PAS614L-VL3 by email, we will give you a best price according your plan.
Buy PAS614L-VL3 with BYCHPS
Buy with guarantee
PAS614L-VL3
- Part Number:
- PAS614L-VL3
- Manufacturer:
- Taiyo Yuden
- Description:
- CAP PAS COIN-TYPE 3.3V 10UAH 0.0
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17844 Pieces
- Data sheet:
- 1.PAS614L-VL3.pdf2.PAS614L-VL3.pdf
Introduction
Specifications
| Voltage - Rated: | 3.3V |
|---|---|
| Tolerance: | - |
| Termination: | Surface Mount |
| Size / Dimension: | 0.268" Dia (6.80mm) |
| Series: | PAS |
| Packaging: | Tray |
| Package / Case: | Coin, Thin Terminals - Same Sides |
| Other Names: | CP PAS614L-VL3 |
| Operating Temperature: | -20°C ~ 60°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | PAS614L-VL3 |
| Lifetime @ Temp.: | - |
| Lead Spacing: | - |
| Height - Seated (Max): | 0.071" (1.80mm) |
| Expanded Description: | 300mF (EDLC) Supercapacitor 3.3V Coin, Thin Terminals - Same Sides 80 Ohm |
| ESR (Equivalent Series Resistance): | 80 Ohm |
| Description: | CAP PAS COIN-TYPE 3.3V 10UAH 0.0 |
| Capacitance: | 300mF |
| Email: | [email protected] |
Related parts for PAS614L-VL3
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
FC0H473ZFTBR24 | KEMET | CAP 47MF -20% +80% 5.5V SMD | Inquiry |
 |
HV1635-2R7356-R | Eaton | CAP 35F -10% +30% 2.7V T/H | Inquiry |
 |
EEC-EN0F204J1 | Panasonic Electronic Components | CAP 200MF -20% +80% 3.3V SMD | Inquiry |
 |
DMT3N4R2U224M3DTA0 | Murata Electronics North America | CAPACITOR 220MF 20% 4.2V SMD | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers