BYCHIPS is the stocking distributor for NF13AA0809M--, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for NF13AA0809M-- by email, we will give you a best price according your plan.
Buy NF13AA0809M-- with BYCHPS
Buy with guarantee
NF13AA0809M--
- Part Number:
- NF13AA0809M--
- Manufacturer:
- AVX Corporation
- Description:
- ICL 8 OHM 20% 3.6A 13MM
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 17632 Pieces
- Data sheet:
- NF13AA0809M--.pdf
Introduction
Specifications
| Tolerance: | ±20% |
|---|---|
| Series: | NF13 |
| R @ Current: | 0.25 Ohm |
| R @ 25°C: | 8 Ohm |
| Packaging: | Bulk |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | NF13AA0809M-- |
| Lead Spacing: | 0.300" (7.62mm) |
| Expanded Description: | Inrush Current Limiter 8 Ohm Ohm ±20% 0.51" (13mm) |
| Diameter: | 0.51" (13mm) |
| Description: | ICL 8 OHM 20% 3.6A 13MM |
| Current - Steady State Max: | 3.6A |
| Approvals: | cUL |
| Email: | [email protected] |
Related parts for NF13AA0809M--
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
NF13AA0220M-- | AVX Corporation | ICL 22 OHM 20% 2.3A 13MM | Inquiry |
|
NF13AA0400M-- | AVX Corporation | ICL 40 OHM 20% 2A 13MM | Inquiry |
|
NF13AA0509M-- | AVX Corporation | ICL 5 OHM 20% 4.2A 13MM | Inquiry |
|
NF13AA0709M-- | AVX Corporation | ICL 7 OHM 20% 3.7A 13MM | Inquiry |
 |
MF72-030D9 | Cantherm | ICL 30 OHM 20% 1A 11MM | Inquiry |
|
NF13AA0259M-- | AVX Corporation | ICL 2.5 OHM 20% 5.7A 13MM | Inquiry |
|
NF13AA0330M-- | AVX Corporation | ICL 33 OHM 20% 2.2A 13MM | Inquiry |
|
NF13AA0100M-- | AVX Corporation | ICL 10 OHM 20% 3.3A 13MM | Inquiry |
|
NF13AA0600M-- | AVX Corporation | ICL 60 OHM 20% 1.9A 13MM | Inquiry |
 |
MF72-005D15 | Cantherm | ICL 5 OHM 20% 6A 17.5MM | Inquiry |
|
NF13AA0150M-- | AVX Corporation | ICL 15 OHM 20% 2.8A 13MM | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers