BYCHIPS is the stocking distributor for HB1030-2R5106-1, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for HB1030-2R5106-1 by email, we will give you a best price according your plan.
Buy HB1030-2R5106-1 with BYCHPS
Buy with guarantee
HB1030-2R5106-1
- Part Number:
- HB1030-2R5106-1
- Manufacturer:
- Bussmann (Eaton)
- Description:
- CAP 10F -10%, +30% 2.5V T/HOLE
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 13694 Pieces
- Data sheet:
- HB1030-2R5106-1.pdf
Introduction
Specifications
| Voltage - Rated: | 2.5V |
|---|---|
| Tolerance: | -10%, +30% |
| Termination: | - |
| Size / Dimension: | 0.394" Dia (10.00mm) |
| Series: | PowerStor HB |
| Packaging: | Bulk |
| Package / Case: | Radial, Can |
| Operating Temperature: | -25°C ~ 70°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 13 Weeks |
| Manufacturer Part Number: | HB1030-2R5106-1 |
| Lifetime @ Temp.: | 1000 Hrs @ 70°C |
| Lead Spacing: | 0.197" (5.00mm) |
| Height - Seated (Max): | 1.220" (31.00mm) |
| Expanded Description: | 10F -10%, +30%(EDLC) Supercapacitor 2.5V Radial, Can 60 mOhm 1000 Hrs @ 70°C |
| ESR (Equivalent Series Resistance): | 60 mOhm |
| Description: | CAP 10F -10%, +30% 2.5V T/HOLE |
| Capacitance: | 10F |
| Email: | [email protected] |
Related parts for HB1030-2R5106-1
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
HB1030-2R5106-R | Eaton | CAP 10F -10% +30% 2.5V T/H | Inquiry |
 |
BZ019B223ZSB | AVX Corporation | CAP 22MF -20% +80% 9V SMD | Inquiry |
 |
XV3560-2R7407-R | Eaton | CAP 400F -5% +10% 2.7V T/H | Inquiry |
 |
PHV-5R4H255-R | Eaton | CAP 2.5F -10% +30% 5.4V T/H | Inquiry |
 |
PAS1020LA3R0405 | Taiyo Yuden | CAP 4F 20% 3V THROUGH HOLE | Inquiry |
 |
JJC0E127MELB | Nichicon | CAP 120F 20% 2.5V THROUGH HOLE | Inquiry |
 |
JUMT1475MHD | Nichicon | CAP 4.7F 20% 2.7V THROUGH HOLE | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers