BYCHIPS is the stocking distributor for XV3560-2R7407-R, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for XV3560-2R7407-R by email, we will give you a best price according your plan.
Buy XV3560-2R7407-R with BYCHPS
Buy with guarantee
XV3560-2R7407-R
- Part Number:
- XV3560-2R7407-R
- Manufacturer:
- Bussmann (Eaton)
- Description:
- CAP 400F -5% +10% 2.7V T/H
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17518 Pieces
- Data sheet:
- XV3560-2R7407-R.pdf
Introduction
Specifications
| Voltage - Rated: | 2.7V |
|---|---|
| Tolerance: | -5%, +10% |
| Termination: | Through Hole |
| Size / Dimension: | 1.378" Dia (35.00mm) |
| Series: | PowerStor XV |
| Packaging: | Bulk |
| Package / Case: | Radial, Can - Snap-In |
| Other Names: | 283-4209 XV35602R7407R |
| Operating Temperature: | -40°C ~ 65°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 15 Weeks |
| Manufacturer Part Number: | XV3560-2R7407-R |
| Lifetime @ Temp.: | 1500 Hrs @ 65°C |
| Lead Spacing: | 0.886" (22.50mm) |
| Height - Seated (Max): | 2.480" (63.00mm) |
| Expanded Description: | 400F -5%, +10%(EDLC) Supercapacitor 2.7V Radial, Can - Snap-In 3.2 mOhm 1500 Hrs @ 65°C |
| ESR (Equivalent Series Resistance): | 3.2 mOhm |
| Description: | CAP 400F -5% +10% 2.7V T/H |
| Capacitance: | 400F |
| Email: | [email protected] |
Related parts for XV3560-2R7407-R
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
KR-5R5H224-R | Eaton | CAP 220MF -20% +80% 5.5V T/H | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers