BYCHIPS is the stocking distributor for BZ054B223ZSB, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BZ054B223ZSB by email, we will give you a best price according your plan.
Buy BZ054B223ZSB with BYCHPS
Buy with guarantee
BZ054B223ZSB
- Part Number:
- BZ054B223ZSB
- Manufacturer:
- AVX Corporation
- Description:
- CAP 22MF -20% +80% 4.5V SMD
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18935 Pieces
- Data sheet:
- BZ054B223ZSB.pdf
Introduction
Specifications
| Voltage - Rated: | 4.5V |
|---|---|
| Tolerance: | -20%, +80% |
| Termination: | Solder Tabs |
| Size / Dimension: | 0.787" L x 0.591" W (20.00mm x 15.00mm) |
| Series: | BestCap® BZ |
| Packaging: | Tray |
| Package / Case: | BZ05, 3 Lead |
| Other Names: | 478-3519 |
| Operating Temperature: | -20°C ~ 70°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 13 Weeks |
| Manufacturer Part Number: | BZ054B223ZSB |
| Lifetime @ Temp.: | 1000 Hrs @ 70°C |
| Lead Spacing: | - |
| Height - Seated (Max): | 0.083" (2.10mm) |
| Expanded Description: | 22mF -20%, +80%(EDLC) Supercapacitor 4.5V BZ05, 3 Lead 170 mOhm 1000 Hrs @ 70°C |
| ESR (Equivalent Series Resistance): | 170 mOhm |
| Description: | CAP 22MF -20% +80% 4.5V SMD |
| Capacitance: | 22mF |
| Email: | [email protected] |
Related parts for BZ054B223ZSB
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
PAS1020LA3R0405 | Taiyo Yuden | CAP 4F 20% 3V THROUGH HOLE | Inquiry |
 |
JJC0E127MELB | Nichicon | CAP 120F 20% 2.5V THROUGH HOLE | Inquiry |
 |
DXJ-5R5H104U | Elna America | CAP 100MF -20% +80% 5.5V T/H | Inquiry |
 |
HB1030-2R5106-1 | Eaton | CAP 10F -10%, +30% 2.5V T/HOLE | Inquiry |
 |
PHV-5R4H255-R | Eaton | CAP 2.5F -10% +30% 5.4V T/H | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers