BYCHIPS is the stocking distributor for BSB028N06NN3 G, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for BSB028N06NN3 G by email, we will give you a best price according your plan.
Buy BSB028N06NN3 G with BYCHPS
Buy with guarantee
BSB028N06NN3 G
- Part Number:
- BSB028N06NN3 G
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Description:
- MOSFET N-CH 60V 22A WDSON-2
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13032 Pieces
- Data sheet:
- BSB028N06NN3 G.pdf
Introduction
Specifications
| Vgs(th) (Max) @ Id: | 4V @ 102µA |
|---|---|
| Vgs (Max): | ±20V |
| Technology: | MOSFET (Metal Oxide) |
| Supplier Device Package: | MG-WDSON-2, CanPAK M™ |
| Series: | OptiMOS™ |
| Rds On (Max) @ Id, Vgs: | 2.8 mOhm @ 30A, 10V |
| Power Dissipation (Max): | 2.2W (Ta), 78W (Tc) |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 3-WDSON |
| Other Names: | BSB028N06NN3 G-ND BSB028N06NN3G BSB028N06NN3GXUMA1 SP000605956 |
| Operating Temperature: | -40°C ~ 150°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 10 Weeks |
| Manufacturer Part Number: | BSB028N06NN3 G |
| Input Capacitance (Ciss) (Max) @ Vds: | 12000pF @ 30V |
| Gate Charge (Qg) (Max) @ Vgs: | 143nC @ 10V |
| FET Type: | N-Channel |
| FET Feature: | - |
| Expanded Description: | N-Channel 60V 22A (Ta), 90A (Tc) 2.2W (Ta), 78W (Tc) Surface Mount MG-WDSON-2, CanPAK M™ |
| Drive Voltage (Max Rds On, Min Rds On): | 10V |
| Drain to Source Voltage (Vdss): | 60V |
| Description: | MOSFET N-CH 60V 22A WDSON-2 |
| Current - Continuous Drain (Id) @ 25°C: | 22A (Ta), 90A (Tc) |
| Email: | [email protected] |
Related parts for BSB028N06NN3 G
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers