BYCHIPS is the stocking distributor for APT65GP60J, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for APT65GP60J by email, we will give you a best price according your plan.
Buy APT65GP60J with BYCHPS
Buy with guarantee
APT65GP60J
- Part Number:
- APT65GP60J
- Manufacturer:
- Microsemi
- Description:
- IGBT 600V 130A 431W SOT227
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14936 Pieces
- Data sheet:
- APT65GP60J.pdf
Introduction
Specifications
| Voltage - Collector Emitter Breakdown (Max): | 600V |
|---|---|
| Vce(on) (Max) @ Vge, Ic: | 2.7V @ 15V, 65A |
| Supplier Device Package: | ISOTOP® |
| Series: | POWER MOS 7® |
| Power - Max: | 431W |
| Package / Case: | SOT-227-4, miniBLOC |
| Operating Temperature: | -55°C ~ 150°C (TJ) |
| NTC Thermistor: | No |
| Mounting Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | APT65GP60J |
| Input Capacitance (Cies) @ Vce: | 7.4nF @ 25V |
| Input: | Standard |
| IGBT Type: | PT |
| Expanded Description: | IGBT Module PT Single 600V 130A 431W Chassis Mount ISOTOP® |
| Description: | IGBT 600V 130A 431W SOT227 |
| Current - Collector Cutoff (Max): | 1mA |
| Current - Collector (Ic) (Max): | 130A |
| Configuration: | Single |
| Email: | [email protected] |
Related parts for APT65GP60J
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
APT65GP60B2G | Microsemi Corporation | IGBT 600V 100A 833W TMAX | Inquiry |
 |
APT65GP60L2DQ2G | Microsemi Corporation | IGBT 600V 198A 833W TO264 | Inquiry |
 |
APTGT30H60T3G | Microsemi Corporation | IGBT MOD TRENCH FULL BRIDGE SP3 | Inquiry |
 |
VII130-06P1 | IXYS | MOD IGBT PHASE LEG 600V ECOPAC2 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers