BYCHIPS is the stocking distributor for A1030-2R5155-AP, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for A1030-2R5155-AP by email, we will give you a best price according your plan.
Buy A1030-2R5155-AP with BYCHPS
Buy with guarantee
A1030-2R5155-AP
- Part Number:
- A1030-2R5155-AP
- Manufacturer:
- Bussmann (Eaton)
- Description:
- CAP 1.5F -20%, +80% 2.5V T/H
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 19326 Pieces
- Data sheet:
- A1030-2R5155-AP.pdf
Introduction
Specifications
| Voltage - Rated: | 2.5V |
|---|---|
| Tolerance: | -20%, +80% |
| Termination: | - |
| Size / Dimension: | 0.394" Dia (10.00mm) |
| Series: | PowerStor A |
| Packaging: | Bulk |
| Package / Case: | Radial, Can |
| Operating Temperature: | -25°C ~ 70°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 10 Weeks |
| Manufacturer Part Number: | A1030-2R5155-AP |
| Lifetime @ Temp.: | 1000 Hrs @ 70°C |
| Lead Spacing: | 0.197" (5.00mm) |
| Height - Seated (Max): | 1.220" (31.00mm) |
| Expanded Description: | 1.5F -20%, +80%(EDLC) Supercapacitor 2.5V Radial, Can 60 mOhm 1000 Hrs @ 70°C |
| ESR (Equivalent Series Resistance): | 60 mOhm |
| Description: | CAP 1.5F -20%, +80% 2.5V T/H |
| Capacitance: | 1.5F |
| Email: | [email protected] |
Related parts for A1030-2R5155-AP
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
JUWT1226MHD | Nichicon | CAP 22F 20% 2.7V THROUGH HOLE | Inquiry |
 |
FYD0H105ZF | KEMET | CAP 1F -20% +80% 5.5V T/H | Inquiry |
 |
JUWT1475MPD | Nichicon | CAP 4.7F 20% 2.7V THROUGH HOLE | Inquiry |
 |
PAS409HR-VE5R | Taiyo Yuden | CAP 30MF 3.3V SURFACE MOUNT | Inquiry |
 |
A1030-2R5155 | Eaton | CAP 1.5F -20% +80% 2.5V T/H | Inquiry |
|
A1030-2R5155-R | Eaton | CAP 1.5F -20% +80% 2.5V T/H | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog