BYCHIPS is the stocking distributor for FYD0H105ZF, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for FYD0H105ZF by email, we will give you a best price according your plan.
Buy FYD0H105ZF with BYCHPS
Buy with guarantee
FYD0H105ZF
- Part Number:
- FYD0H105ZF
- Manufacturer:
- KEMET
- Description:
- CAP 1F -20% +80% 5.5V T/H
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13573 Pieces
- Data sheet:
- FYD0H105ZF.pdf
Introduction
Specifications
| Voltage - Rated: | 5.5V |
|---|---|
| Tolerance: | -20%, +80% |
| Termination: | Through Hole |
| Size / Dimension: | 0.846" Dia (21.50mm) |
| Series: | FYD |
| Packaging: | Bulk |
| Package / Case: | Radial, Can |
| Other Names: | 399-10811 |
| Operating Temperature: | -25°C ~ 70°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 16 Weeks |
| Manufacturer Part Number: | FYD0H105ZF |
| Lifetime @ Temp.: | - |
| Lead Spacing: | 0.300" (7.62mm) |
| Height - Seated (Max): | 0.630" (16.00mm) |
| Expanded Description: | 1F -20%, +80%(EDLC) Supercapacitor 5.5V Radial, Can 35 Ohm @ 1kHz |
| ESR (Equivalent Series Resistance): | 35 Ohm @ 1kHz |
| Description: | CAP 1F -20% +80% 5.5V T/H |
| Capacitance: | 1F |
| Email: | [email protected] |
Related parts for FYD0H105ZF
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
FYD0H104ZF | KEMET | CAP 100MF -20% +80% 5.5V T/H | Inquiry |
 |
FYD0H225ZF | KEMET | CAP 2.2F -20% +80% 5.5V T/H | Inquiry |
 |
EEC-EN0F204RL | Panasonic Electronic Components | CAP 200MF -20% +80% 3.3V SMD | Inquiry |
 |
FYD0H474ZF | KEMET | CAP 470MF -20% +80% 5.5V T/H | Inquiry |
 |
DCK-3R3D204T614 | Elna America | CAP 200MF -20% +80% 3.3V SMD | Inquiry |
 |
PAS409HR-VE5R | Taiyo Yuden | CAP 30MF 3.3V SURFACE MOUNT | Inquiry |
 |
JUWT1226MHD | Nichicon | CAP 22F 20% 2.7V THROUGH HOLE | Inquiry |
 |
FYD0H473ZF | KEMET | CAP 47MF -20% +80% 5.5V T/H | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers