BYCHIPS is the stocking distributor for SSTUA32S865ET/G,51, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for SSTUA32S865ET/G,51 by email, we will give you a best price according your plan.
Buy SSTUA32S865ET/G,51 with BYCHPS
Buy with guarantee
SSTUA32S865ET/G,51
- Part Number:
- SSTUA32S865ET/G,51
- Manufacturer:
- NXP Semiconductors / Freescale
- Description:
- IC REG BUFFER 28BIT 160TFBGA
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13453 Pieces
- Data sheet:
- SSTUA32S865ET/G,51.pdf
Introduction
Specifications
| Supply Voltage: | 1.7 V ~ 2 V |
|---|---|
| Supplier Device Package: | 160-TFBGA (9x13) |
| Series: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 160-TFBGA |
| Other Names: | 568-3540-2 935279445518 SSTUA32S865ET/G-T |
| Operating Temperature: | 0°C ~ 70°C |
| Number of Bits: | 28 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 2 (1 Year) |
| Manufacturer Part Number: | SSTUA32S865ET/G,51 |
| Logic Type: | 1:2 Registered Buffer with Parity |
| Expanded Description: | 1:2 Registered Buffer with Parity IC 160-TFBGA (9x13) |
| Description: | IC REG BUFFER 28BIT 160TFBGA |
| Email: | [email protected] |
Related parts for SSTUA32S865ET/G,51
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
SSTUA32S865ET,518 | NXP USA Inc. | IC BUFFER 1.8V 28BIT SOT802-1 | Inquiry |
|
SSTUA32S865ET,557 | NXP USA Inc. | IC BUFFER 1.8V 28BIT SOT802-1 | Inquiry |
|
SSTUA32S865ET/G,55 | NXP USA Inc. | IC BUFFER 1.8V 28BIT SOT802 | Inquiry |
 |
SSTUA32S868ET,518 | NXP USA Inc. | IC BUFFER 1.8V 56BIT 176-TFBGA | Inquiry |
|
SSTUA32S865ET/G;55 | NXP USA Inc. | IC BUFFER 1.8V 28BIT SOT802 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers