BYCHIPS is the stocking distributor for SSTUA32S865ET,557, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for SSTUA32S865ET,557 by email, we will give you a best price according your plan.
Buy SSTUA32S865ET,557 with BYCHPS
Buy with guarantee
SSTUA32S865ET,557
- Part Number:
- SSTUA32S865ET,557
- Manufacturer:
- NXP Semiconductors / Freescale
- Description:
- IC BUFFER 1.8V 28BIT SOT802-1
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18274 Pieces
- Data sheet:
- SSTUA32S865ET,557.pdf
Introduction
Specifications
| Supply Voltage: | 1.7 V ~ 2 V |
|---|---|
| Supplier Device Package: | 160-TFBGA (9x13) |
| Series: | - |
| Packaging: | Tray |
| Package / Case: | 160-TFBGA |
| Other Names: | 935279444557 SSTUA32S865ET SSTUA32S865ET-ND |
| Operating Temperature: | 0°C ~ 70°C |
| Number of Bits: | 28 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Part Number: | SSTUA32S865ET,557 |
| Logic Type: | 1:2 Registered Buffer with Parity |
| Expanded Description: | 1:2 Registered Buffer with Parity IC 160-TFBGA (9x13) |
| Description: | IC BUFFER 1.8V 28BIT SOT802-1 |
| Email: | [email protected] |
Related parts for SSTUA32S865ET,557
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
SSTUA32S865ET/G,55 | NXP USA Inc. | IC BUFFER 1.8V 28BIT SOT802 | Inquiry |
|
SSTUA32S865ET/G;55 | NXP USA Inc. | IC BUFFER 1.8V 28BIT SOT802 | Inquiry |
|
SSTUA32S865ET/G,51 | NXP USA Inc. | IC REG BUFFER 28BIT 160TFBGA | Inquiry |
 |
SSTUA32S868ET,518 | NXP USA Inc. | IC BUFFER 1.8V 56BIT 176-TFBGA | Inquiry |
|
SSTUA32S865ET,518 | NXP USA Inc. | IC BUFFER 1.8V 28BIT SOT802-1 | Inquiry |
 |
SSTUA32866EC/G,557 | NXP USA Inc. | IC BUFFER 1.8V 25BIT SOT536-1 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers