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EPC2108ENGRT
- Part Number:
- EPC2108ENGRT
- Manufacturer:
- EPC
- Description:
- TRANS GAN 3N-CH BUMPED DIE
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19473 Pieces
- Data sheet:
- EPC2108ENGRT.pdf
Introduction
Specifications
| Vgs(th) (Max) @ Id: | 2.5V @ 200µA |
|---|---|
| Supplier Device Package: | Die |
| Series: | eGaN® |
| Rds On (Max) @ Id, Vgs: | 190 mOhm @ 2.5A, 5V |
| Power - Max: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | Die |
| Other Names: | 917-EPC2108ENGRTR |
| Operating Temperature: | -40°C ~ 150°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | EPC2108ENGRT |
| Input Capacitance (Ciss) (Max) @ Vds: | 22pF @ 30V |
| Gate Charge (Qg) (Max) @ Vgs: | 0.22nC @ 5V |
| FET Type: | 3 N-Channel (Half Bridge + Synchronous Bootstrap) |
| FET Feature: | GaNFET (Gallium Nitride) |
| Expanded Description: | Mosfet Array 3 N-Channel (Half Bridge + Synchronous Bootstrap) 60V, 100V 1.7A, 500mA Surface Mount Die |
| Drain to Source Voltage (Vdss): | 60V, 100V |
| Description: | TRANS GAN 3N-CH BUMPED DIE |
| Current - Continuous Drain (Id) @ 25°C: | 1.7A, 500mA |
| Email: | [email protected] |
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