EPC2025ENGR
EPC2025ENGR
Part Number:
EPC2025ENGR
Manufacturer:
EPC
Description:
TRANS GAN 300V 4A BUMPED DIE
Lead Free Status / RoHS Status:
Lead free / RoHS Compliant
Available Quantity:
14400 Pieces
Data sheet:
EPC2025ENGR.pdf

Introduction

BYCHIPS is the stocking distributor for EPC2025ENGR, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for EPC2025ENGR by email, we will give you a best price according your plan.
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Specifications

Vgs(th) (Max) @ Id:2.5V @ 1mA
Technology:GaNFET (Gallium Nitride)
Supplier Device Package:Die Outline (12-Solder Bar)
Series:eGaN®
Rds On (Max) @ Id, Vgs:150 mOhm @ 3A, 5V
Power Dissipation (Max):-
Packaging:Tray
Package / Case:Die
Other Names:917-EPC2025ENGR
EPC2025ENGRC
Operating Temperature:-40°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Moisture Sensitivity Level (MSL):1 (Unlimited)
Manufacturer Part Number:EPC2025ENGR
Input Capacitance (Ciss) (Max) @ Vds:194pF @ 240V
Gate Charge (Qg) (Max) @ Vgs:1.85nC @ 5V
FET Type:N-Channel
FET Feature:-
Expanded Description:N-Channel 300V 4A (Ta) Surface Mount Die Outline (12-Solder Bar)
Drain to Source Voltage (Vdss):300V
Description:TRANS GAN 300V 4A BUMPED DIE
Current - Continuous Drain (Id) @ 25°C:4A (Ta)
Email:[email protected]

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