EPC2023ENG
EPC2023ENG
Part Number:
EPC2023ENG
Manufacturer:
EPC
Description:
TRANS GAN 30V 60A BUMPED DIE
Lead Free Status / RoHS Status:
Lead free / RoHS Compliant
Available Quantity:
16591 Pieces
Data sheet:
EPC2023ENG.pdf

Introduction

BYCHIPS is the stocking distributor for EPC2023ENG, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for EPC2023ENG by email, we will give you a best price according your plan.
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Specifications

Vgs(th) (Max) @ Id:2.5V @ 20mA
Technology:GaNFET (Gallium Nitride)
Supplier Device Package:Die
Series:eGaN®
Rds On (Max) @ Id, Vgs:1.3 mOhm @ 40A, 5V
Power Dissipation (Max):-
Packaging:Tray
Package / Case:Die
Other Names:917-EPC2023ENG
EPC2023ENGRC2
Operating Temperature:-40°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Moisture Sensitivity Level (MSL):1 (Unlimited)
Manufacturer Standard Lead Time:22 Weeks
Manufacturer Part Number:EPC2023ENG
Input Capacitance (Ciss) (Max) @ Vds:2300pF @ 15V
Gate Charge (Qg) (Max) @ Vgs:20nC @ 5V
FET Type:N-Channel
FET Feature:-
Expanded Description:N-Channel 30V 60A (Ta) Surface Mount Die
Drain to Source Voltage (Vdss):30V
Description:TRANS GAN 30V 60A BUMPED DIE
Current - Continuous Drain (Id) @ 25°C:60A (Ta)
Email:[email protected]

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