BYCHIPS is the stocking distributor for C3D06060G, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for C3D06060G by email, we will give you a best price according your plan.
Buy C3D06060G with BYCHPS
Buy with guarantee
C3D06060G
- Part Number:
- C3D06060G
- Manufacturer:
- Cree
- Description:
- DIODE SCHOTTKY 600V 6A TO263-2
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18533 Pieces
- Data sheet:
- C3D06060G.pdf
Introduction
Specifications
| Voltage - Forward (Vf) (Max) @ If: | 1.7V @ 6A |
|---|---|
| Voltage - DC Reverse (Vr) (Max): | 600V |
| Supplier Device Package: | TO-263-2 |
| Speed: | No Recovery Time > 500mA (Io) |
| Series: | Z-Rec® |
| Reverse Recovery Time (trr): | 0ns |
| Packaging: | Tube |
| Package / Case: | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Operating Temperature - Junction: | -55°C ~ 175°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 4 Weeks |
| Manufacturer Part Number: | C3D06060G |
| Expanded Description: | Diode Silicon Carbide Schottky 600V 6A (DC) Surface Mount TO-263-2 |
| Diode Type: | Silicon Carbide Schottky |
| Description: | DIODE SCHOTTKY 600V 6A TO263-2 |
| Current - Reverse Leakage @ Vr: | 50µA @ 600V |
| Current - Average Rectified (Io): | 6A (DC) |
| Capacitance @ Vr, F: | 295pF @ 0V, 1MHz |
| Email: | [email protected] |
Related parts for C3D06060G
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
C3D06060G-TR | Cree/Wolfspeed | DIODE SCHOTTKY 600V 6A TO263-2 | Inquiry |
 |
C3D06060A | Cree/Wolfspeed | DIODE SCHOTTKY 600V 6A TO220-2 | Inquiry |
 |
C3D06065E | Cree/Wolfspeed | DIODE SCHOTTKY 650V 2A TO252-2 | Inquiry |
|
C3D06065A | Cree/Wolfspeed | DIODE SCHOTTKY 650V 6A TO220-2 | Inquiry |
 |
C3D06060F | Cree/Wolfspeed | DIODE SCHOTTKY 600V 6A TO220-F2 | Inquiry |
 |
C3D06065I | Cree/Wolfspeed | DIODE SCHOTTKY 650V 13A TO220-2 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers