BYCHIPS is the stocking distributor for C3D06060G-TR, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for C3D06060G-TR by email, we will give you a best price according your plan.
Buy C3D06060G-TR with BYCHPS
Buy with guarantee
C3D06060G-TR
- Part Number:
- C3D06060G-TR
- Manufacturer:
- Cree
- Description:
- DIODE SCHOTTKY 600V 6A TO263-2
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12167 Pieces
- Data sheet:
- C3D06060G-TR.pdf
Introduction
Specifications
| Voltage - Forward (Vf) (Max) @ If: | 1.7V @ 6A |
|---|---|
| Voltage - DC Reverse (Vr) (Max): | 600V |
| Supplier Device Package: | TO-263-2 |
| Speed: | No Recovery Time > 500mA (Io) |
| Series: | Z-Rec® |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Operating Temperature - Junction: | -55°C ~ 175°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 5 Weeks |
| Manufacturer Part Number: | C3D06060G-TR |
| Expanded Description: | Diode Silicon Carbide Schottky 600V 6A (DC) Surface Mount TO-263-2 |
| Diode Type: | Silicon Carbide Schottky |
| Description: | DIODE SCHOTTKY 600V 6A TO263-2 |
| Current - Reverse Leakage @ Vr: | 50µA @ 600V |
| Current - Average Rectified (Io): | 6A (DC) |
| Capacitance @ Vr, F: | 295pF @ 0V, 1MHz |
| Email: | [email protected] |
Related parts for C3D06060G-TR
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
C3D06060A | Cree/Wolfspeed | DIODE SCHOTTKY 600V 6A TO220-2 | Inquiry |
 |
C3D06060G | Cree/Wolfspeed | DIODE SCHOTTKY 600V 6A TO263-2 | Inquiry |
|
C3D06065A | Cree/Wolfspeed | DIODE SCHOTTKY 650V 6A TO220-2 | Inquiry |
 |
C3D06065I | Cree/Wolfspeed | DIODE SCHOTTKY 650V 13A TO220-2 | Inquiry |
 |
C3D06065E | Cree/Wolfspeed | DIODE SCHOTTKY 650V 2A TO252-2 | Inquiry |
 |
C3D06060F | Cree/Wolfspeed | DIODE SCHOTTKY 600V 6A TO220-F2 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers