BYCHIPS is the stocking distributor for XR28V384IM48TR-F, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for XR28V384IM48TR-F by email, we will give you a best price according your plan.
Buy XR28V384IM48TR-F with BYCHPS
Buy with guarantee
XR28V384IM48TR-F
- Part Number:
- XR28V384IM48TR-F
- Manufacturer:
- Exar Corporation
- Description:
- IC QUAD UART W/FIFO 3.3V 48-TQFP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15935 Pieces
- Data sheet:
- XR28V384IM48TR-F.pdf
Introduction
Specifications
| Voltage - Supply: | 3.3V |
|---|---|
| Supplier Device Package: | 48-TQFP (7x7) |
| Standards: | - |
| Series: | - |
| Protocol: | RS232, RS485 |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 48-TQFP |
| Operating Temperature: | -40°C ~ 85°C |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Part Number: | XR28V384IM48TR-F |
| Interface: | LPC |
| Function: | Controller |
| Expanded Description: | RS232, RS485 Controller LPC Interface 48-TQFP (7x7) |
| Description: | IC QUAD UART W/FIFO 3.3V 48-TQFP |
| Current - Supply: | 17mA |
| Email: | [email protected] |
Related parts for XR28V384IM48TR-F
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
XR28V382IL32-F | Exar Corporation | IC DUAL UART W/FIFO 3.3V 32-QFN | Inquiry |
 |
XR28V384IM48-F | Exar Corporation | IC QUAD UART W/FIFO 3.3V 48-TQFP | Inquiry |
|
XR28V382IL32TR-F | Exar Corporation | IC DUAL UART W/FIFO 3.3V 32-QFN | Inquiry |
 |
XR21B1421IL24-F | Exar Corporation | IC UART BRIDGE TO USB 1CH 24-QFN | Inquiry |
 |
FT313HQ-T | FTDI, Future Technology Devices International Ltd | IC USB HS HOST CTRL QFN-64 | Inquiry |
 |
CY7C63833-LTXCT | Cypress Semiconductor Corp | IC USB PERIPHERAL CTRLR 32VQFN | Inquiry |
 |
KSZ8895RQ | Microchip Technology | IC 10/100-T 5 PORT SW 128QFP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers