BYCHIPS is the stocking distributor for XR21V1412IL32-F, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for XR21V1412IL32-F by email, we will give you a best price according your plan.
Buy XR21V1412IL32-F with BYCHPS
Buy with guarantee
XR21V1412IL32-F
- Part Number:
- XR21V1412IL32-F
- Manufacturer:
- Exar Corporation
- Description:
- IC UART FIFO USB DUAL 32QFN
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17589 Pieces
- Data sheet:
- XR21V1412IL32-F.pdf
Introduction
Specifications
| Voltage - Supply: | 2.97 V ~ 3.63 V |
|---|---|
| Supplier Device Package: | 32-QFN (5x5) |
| Standards: | USB 2.0 |
| Series: | - |
| Protocol: | USB |
| Packaging: | Tray |
| Package / Case: | 32-VFQFN Exposed Pad |
| Other Names: | 1016-1302 XR21V1412IL32F |
| Operating Temperature: | -40°C ~ 85°C |
| Moisture Sensitivity Level (MSL): | 2 (1 Year) |
| Manufacturer Standard Lead Time: | 8 Weeks |
| Manufacturer Part Number: | XR21V1412IL32-F |
| Interface: | UART |
| Function: | Bridge, USB to UART |
| Expanded Description: | USB Bridge, USB to UART USB 2.0 UART Interface 32-QFN (5x5) |
| Description: | IC UART FIFO USB DUAL 32QFN |
| Current - Supply: | 16mA |
| Email: | [email protected] |
Related parts for XR21V1412IL32-F
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
XR21V1410IL16-F | Exar Corporation | IC UART FIFO USB SGL 16QFN | Inquiry |
|
XR21V1410IL16TR-F | Exar Corporation | IC USB UART FIFO FULL SPD 16QFN | Inquiry |
 |
USB5826T-I/KD | Microchip Technology | IC HUB CONTROLLER USB 100VQFN | Inquiry |
 |
XR21V1412IL32TR-F | Exar Corporation | IC USB UART FIFO FULL SPD 32QFN | Inquiry |
 |
XR21V1414IM48-F | Exar Corporation | IC UART FIFO USB QUAD 48TQFP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers