BYCHIPS is the stocking distributor for XR18910ILMTR-67, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for XR18910ILMTR-67 by email, we will give you a best price according your plan.
Buy XR18910ILMTR-67 with BYCHPS
Buy with guarantee
XR18910ILMTR-67
- Part Number:
- XR18910ILMTR-67
- Manufacturer:
- Exar Corporation
- Description:
- SENSOR
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13170 Pieces
- Data sheet:
- XR18910ILMTR-67.pdf
Introduction
Specifications
| Type: | Front End |
|---|---|
| Supplier Device Package: | 24-QFN (3.5x3.5) |
| Series: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 24-WFQFN Exposed Pad |
| Output Type: | - |
| Operating Temperature: | -40°C ~ 85°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 8 Weeks |
| Manufacturer Part Number: | XR18910ILMTR-67 |
| Interface: | I²C |
| Input Type: | - |
| Description: | SENSOR |
| Current - Supply: | 457µA |
| Email: | [email protected] |
Related parts for XR18910ILMTR-67
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
XR18910ILTR-64 | Exar Corporation | SENSOR | Inquiry |
 |
XR18910IL-65 | Exar Corporation | SENSOR | Inquiry |
|
XR18910ILMTR-64 | Exar Corporation | SENSOR | Inquiry |
|
XR18910IL-67 | Exar Corporation | SENSOR | Inquiry |
|
XR18910ILTR-66 | Exar Corporation | SENSOR | Inquiry |
|
XR18910ILTR-65 | Exar Corporation | SENSOR | Inquiry |
|
XR18910ILMTR-66 | Exar Corporation | SENSOR | Inquiry |
|
XR18910ILMTR-65 | Exar Corporation | SENSOR | Inquiry |
|
XR18910ILTR-67 | Exar Corporation | SENSOR | Inquiry |
|
XR18910IL-64 | Exar Corporation | SENSOR | Inquiry |
|
XR18910IL-66 | Exar Corporation | SENSOR | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers