BYCHIPS is the stocking distributor for XQ7K410T-2RF676I, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for XQ7K410T-2RF676I by email, we will give you a best price according your plan.
Buy XQ7K410T-2RF676I with BYCHPS
Buy with guarantee
XQ7K410T-2RF676I
- Part Number:
- XQ7K410T-2RF676I
- Manufacturer:
- Xilinx
- Description:
- IC FPGA KINTEX-7 676-FBGA
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 15213 Pieces
- Data sheet:
- XQ7K410T-2RF676I.pdf
Introduction
Specifications
| Voltage - Supply: | 0.97 V ~ 1.03 V |
|---|---|
| Total RAM Bits: | 29306880 |
| Supplier Device Package: | 676-FCBGA (27x27) |
| Series: | Kintex®-7Q |
| Package / Case: | 676-BBGA, FCBGA |
| Operating Temperature: | -40°C ~ 100°C (TJ) |
| Number of Logic Elements/Cells: | 406720 |
| Number of LABs/CLBs: | 31775 |
| Number of I/O: | 400 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 4 (72 Hours) |
| Manufacturer Standard Lead Time: | 6 Weeks |
| Manufacturer Part Number: | XQ7K410T-2RF676I |
| Description: | IC FPGA KINTEX-7 676-FBGA |
| Email: | [email protected] |
Related parts for XQ7K410T-2RF676I
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
XQ7K410T-1RF676I | Xilinx Inc. | IC FPGA KINTEX-7 676-FBGA | Inquiry |
|
XQ7K410T-1RF900M | Xilinx Inc. | IC FPGA KINTEX-7 900-FBGA | Inquiry |
|
XQ7K410T-1RF900I | Xilinx Inc. | IC FPGA KINTEX-7 900-FBGA | Inquiry |
|
XQ7K410T-2RF900I | Xilinx Inc. | IC FPGA KINTEX-7 900-FBGA | Inquiry |
|
XQ7K410T-L2RF676E | Xilinx Inc. | IC FPGA KINTEX-7 676-FBGA | Inquiry |
|
XQ7K410T-L2RF900E | Xilinx Inc. | IC FPGA KINTEX-7 900-FBGA | Inquiry |
|
XQ7K410T-1RF676M | Xilinx Inc. | IC FPGA KINTEX-7 676-FBGA | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers