BYCHIPS is the stocking distributor for XE167FH200F100LABKXUMA1, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for XE167FH200F100LABKXUMA1 by email, we will give you a best price according your plan.
Buy XE167FH200F100LABKXUMA1 with BYCHPS
Buy with guarantee
XE167FH200F100LABKXUMA1
- Part Number:
- XE167FH200F100LABKXUMA1
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Description:
- IC MCU 16BIT 1.5MB FLASH 144LQFP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13051 Pieces
- Data sheet:
- XE167FH200F100LABKXUMA1.pdf
Introduction
Specifications
| Voltage - Supply (Vcc/Vdd): | 3 V ~ 5.5 V |
|---|---|
| Supplier Device Package: | PG-LQFP-144-13 |
| Speed: | 100MHz |
| Series: | XE16xxH |
| RAM Size: | 138K x 8 |
| Program Memory Type: | FLASH |
| Program Memory Size: | 1.56MB (1.56M x 8) |
| Peripherals: | I²S, POR, PWM, WDT |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 144-LQFP Exposed Pad |
| Other Names: | SP000845650 |
| Oscillator Type: | Internal |
| Operating Temperature: | -40°C ~ 125°C (TA) |
| Number of I/O: | 118 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 26 Weeks |
| Manufacturer Part Number: | XE167FH200F100LABKXUMA1 |
| Expanded Description: | C166SV2 XE16xxH Microcontroller IC 16-Bit 100MHz 1.56MB (1.56M x 8) FLASH PG-LQFP-144-13 |
| EEPROM Size: | - |
| Description: | IC MCU 16BIT 1.5MB FLASH 144LQFP |
| Data Converters: | A/D 24x10b |
| Core Size: | 16-Bit |
| Core Processor: | C166SV2 |
| Connectivity: | CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI |
| Email: | [email protected] |
Related parts for XE167FH200F100LABKXUMA1
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers