BYCHIPS is the stocking distributor for XCKU115-3FLVB1760E, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for XCKU115-3FLVB1760E by email, we will give you a best price according your plan.
Buy XCKU115-3FLVB1760E with BYCHPS
Buy with guarantee
XCKU115-3FLVB1760E
- Part Number:
- XCKU115-3FLVB1760E
- Manufacturer:
- Xilinx
- Description:
- IC FPGA 702 I/O 1760FCBGA
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15429 Pieces
Introduction
Specifications
| Voltage - Supply: | 0.970 V ~ 1.030 V |
|---|---|
| Total RAM Bits: | 77721600 |
| Supplier Device Package: | 1760-FCBGA (42.5x42.5) |
| Series: | Kintex® UltraScale™ |
| Package / Case: | 1760-BBGA, FCBGA |
| Operating Temperature: | 0°C ~ 100°C (TJ) |
| Number of Logic Elements/Cells: | 1451100 |
| Number of LABs/CLBs: | 82920 |
| Number of I/O: | 702 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 2A (4 Weeks) |
| Manufacturer Standard Lead Time: | 6 Weeks |
| Manufacturer Part Number: | XCKU115-3FLVB1760E |
| Description: | IC FPGA 702 I/O 1760FCBGA |
| Email: | [email protected] |
Related parts for XCKU115-3FLVB1760E
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers