BYCHIPS is the stocking distributor for XC7K410T-3FBG676E, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for XC7K410T-3FBG676E by email, we will give you a best price according your plan.
Buy XC7K410T-3FBG676E with BYCHPS
Buy with guarantee
XC7K410T-3FBG676E
- Part Number:
- XC7K410T-3FBG676E
- Manufacturer:
- Xilinx
- Description:
- IC FPGA 400 I/O 676FCBGA
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16487 Pieces
Introduction
Specifications
| Voltage - Supply: | 0.97 V ~ 1.03 V |
|---|---|
| Total RAM Bits: | 29306880 |
| Supplier Device Package: | 676-FCBGA (27x27) |
| Series: | Kintex®-7 |
| Package / Case: | 676-BBGA, FCBGA |
| Operating Temperature: | 0°C ~ 100°C (TJ) |
| Number of Logic Elements/Cells: | 406720 |
| Number of LABs/CLBs: | 31775 |
| Number of I/O: | 400 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 4 (72 Hours) |
| Manufacturer Standard Lead Time: | 12 Weeks |
| Manufacturer Part Number: | XC7K410T-3FBG676E |
| Description: | IC FPGA 400 I/O 676FCBGA |
| Email: | [email protected] |
Related parts for XC7K410T-3FBG676E
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers