BYCHIPS is the stocking distributor for XC7K355T-2FFV901C, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for XC7K355T-2FFV901C by email, we will give you a best price according your plan.
Buy XC7K355T-2FFV901C with BYCHPS
Buy with guarantee
XC7K355T-2FFV901C
- Part Number:
- XC7K355T-2FFV901C
- Manufacturer:
- Xilinx
- Description:
- IC FPGA 300 I/O 901FCBGA
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17585 Pieces
- Data sheet:
- XC7K355T-2FFV901C.pdf
Introduction
Specifications
| Voltage - Supply: | 0.97 V ~ 1.03 V |
|---|---|
| Total RAM Bits: | 26357760 |
| Supplier Device Package: | 900-FCBGA (31x31) |
| Series: | Kintex®-7 |
| Package / Case: | 900-BBGA, FCBGA |
| Operating Temperature: | 0°C ~ 85°C (TJ) |
| Number of Logic Elements/Cells: | 356160 |
| Number of LABs/CLBs: | 27825 |
| Number of I/O: | 300 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 2A (4 Weeks) |
| Manufacturer Standard Lead Time: | 24 Weeks |
| Manufacturer Part Number: | XC7K355T-2FFV901C |
| Description: | IC FPGA 300 I/O 901FCBGA |
| Email: | [email protected] |
Related parts for XC7K355T-2FFV901C
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
XC7K355T-L2FFG901E | Xilinx Inc. | IC FPGA 300 I/O 901FCBGA | Inquiry |
|
XC7K355T-1FFG901C | Xilinx Inc. | IC FPGA 300 I/O 901FCBGA | Inquiry |
|
XC7K355T-1FFG901I | Xilinx Inc. | IC FPGA 300 I/O 901FCBGA | Inquiry |
|
XC7K355T-2FFG901I | Xilinx Inc. | IC FPGA 300 I/O 901FCBGA | Inquiry |
|
XC7K355T-L2FFG901I | Xilinx Inc. | IC FPGA 300 I/O 901FCBGA | Inquiry |
 |
XC7K355T-L2FFV901E | Xilinx Inc. | IC FPGA 300 I/O 901FCBGA | Inquiry |
|
XC7K355T-2FF901I | Xilinx Inc. | IC FPGA 300 I/O 901FCBGA | Inquiry |
|
XC7K355T-1FF901I | Xilinx Inc. | IC FPGA 300 I/O 901FCBGA | Inquiry |
|
XC7K355T-2FFG901C | Xilinx Inc. | IC FPGA 300 I/O 901FCBGA | Inquiry |
|
XC7K355T-3FFG901E | Xilinx Inc. | IC FPGA 300 I/O 901FCBGA | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers