BYCHIPS is the stocking distributor for WRM483245-15F5-5V-G, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for WRM483245-15F5-5V-G by email, we will give you a best price according your plan.
Buy WRM483245-15F5-5V-G with BYCHPS
Buy with guarantee
WRM483245-15F5-5V-G
- Part Number:
- WRM483245-15F5-5V-G
- Manufacturer:
- TDK Corporation
- Description:
- RX 1 COIL 1 LAYER 13UH
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17503 Pieces
- Data sheet:
- WRM483245-15F5-5V-G.pdf
Introduction
Specifications
| Type: | 1 Coil, 1 Layer |
|---|---|
| Tolerance: | - |
| Size / Dimension: | 1.89" L x 1.26" W x 0.04" H (48.0mm x 32mm x 1mm) |
| Series: | WRM |
| Q @ Freq: | - |
| Other Names: | 445-16097 |
| Operating Temperature: | - |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | WRM483245-15F5-5V-G |
| Inductance: | 13µH |
| Function: | Receiver |
| Frequency - Self Resonant: | - |
| Expanded Description: | 1 Coil, 1 Layer 13µH Wireless Charging Coil Receiver 270 mOhm |
| Description: | RX 1 COIL 1 LAYER 13UH |
| DC Resistance (DCR): | 270 mOhm |
| Current Rating: | - |
| Current - Saturation: | - |
| Email: | [email protected] |
Related parts for WRM483245-15F5-5V-G
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
WRM483245-15F5-5V-G2 | TDK Corporation | RX 1 COIL 1 LAYER 13UH | Inquiry |
|
WRM483245-15F5-5V-G1 | TDK Corporation | RX 1 COIL 1 LAYER 13UH | Inquiry |
 |
760308103307 | Wurth Electronics Inc. | WE-WPCC WIRELESS POWER CHARGING | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers