BYCHIPS is the stocking distributor for W29GL032CT7A, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for W29GL032CT7A by email, we will give you a best price according your plan.
Buy W29GL032CT7A with BYCHPS
Buy with guarantee
W29GL032CT7A
- Part Number:
- W29GL032CT7A
- Manufacturer:
- Winbond Electronics Corporation
- Description:
- IC FLASH 32MBIT 70NS 48TFBGA
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12777 Pieces
- Data sheet:
- W29GL032CT7A.pdf
Introduction
Specifications
| Voltage - Supply: | 2.7 V ~ 3.6 V |
|---|---|
| Supplier Device Package: | 48-TFBGA (6x8) |
| Speed: | 70ns |
| Series: | - |
| Packaging: | Tray |
| Package / Case: | 48-TFBGA |
| Operating Temperature: | -40°C ~ 85°C (TA) |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Memory Type: | Non-Volatile |
| Memory Size: | 32Mb (4M x 8, 2M x 16) |
| Memory Format: | FLASH |
| Manufacturer Part Number: | W29GL032CT7A |
| Interface: | Parallel |
| Description: | IC FLASH 32MBIT 70NS 48TFBGA |
| Email: | [email protected] |
Related parts for W29GL032CT7A
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
W29GL032CB7B | Winbond Electronics | IC FLASH 32MBIT 70NS 64LFBGA | Inquiry |
 |
W29GL032CT7S | Winbond Electronics | IC FLASH 32MBIT 70NS 48TSOP | Inquiry |
|
W29GL032CH7B | Winbond Electronics | IC FLASH 32MBIT 70NS 64LFBGA | Inquiry |
|
W29GL032CB7S | Winbond Electronics | IC FLASH 32MBIT 70NS 48TSOP | Inquiry |
 |
W29GL032CH7T | Winbond Electronics | IC FLASH 32MBIT 70NS 56TSOP | Inquiry |
|
W29GL032CT7B | Winbond Electronics | IC FLASH 32MBIT 70NS 64LFBGA | Inquiry |
|
W29GL032CL7T | Winbond Electronics | IC FLASH 32MBIT 70NS 56TSOP | Inquiry |
|
W29GL032CL7B | Winbond Electronics | IC FLASH 32MBIT 70NS 64LFBGA | Inquiry |
|
W29GL064CL7T | Winbond Electronics | IC FLASH 64MBIT 70NS 56TSOP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers