BYCHIPS is the stocking distributor for VS-HFA04SD60STRHM3, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for VS-HFA04SD60STRHM3 by email, we will give you a best price according your plan.
Buy VS-HFA04SD60STRHM3 with BYCHPS
Buy with guarantee
VS-HFA04SD60STRHM3
- Part Number:
- VS-HFA04SD60STRHM3
- Manufacturer:
- Vishay / Semiconductor - Diodes Division
- Description:
- DIODE HEXFRED 4A 600V DPAK
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12996 Pieces
- Data sheet:
- VS-HFA04SD60STRHM3.pdf
Introduction
Specifications
| Voltage - Forward (Vf) (Max) @ If: | 1.8V @ 4A |
|---|---|
| Voltage - DC Reverse (Vr) (Max): | 600V |
| Supplier Device Package: | D-PAK (TO-252AA) |
| Speed: | Fast Recovery = 200mA (Io) |
| Series: | Automotive, AEC-Q101 |
| Reverse Recovery Time (trr): | 42ns |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | TO-252-3, DPak (2 Leads + Tab), SC-63 |
| Other Names: | VSHFA04SD60STRHM3 |
| Operating Temperature - Junction: | -55°C ~ 150°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 13 Weeks |
| Manufacturer Part Number: | VS-HFA04SD60STRHM3 |
| Expanded Description: | Diode Standard 600V 4A Surface Mount D-PAK (TO-252AA) |
| Diode Type: | Standard |
| Description: | DIODE HEXFRED 4A 600V DPAK |
| Current - Reverse Leakage @ Vr: | 3µA @ 600V |
| Current - Average Rectified (Io): | 4A |
| Capacitance @ Vr, F: | - |
| Email: | [email protected] |
Related parts for VS-HFA04SD60STRHM3
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers