BYCHIPS is the stocking distributor for VS-GT300FD060N, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for VS-GT300FD060N by email, we will give you a best price according your plan.
Buy VS-GT300FD060N with BYCHPS
Buy with guarantee
VS-GT300FD060N
- Part Number:
- VS-GT300FD060N
- Manufacturer:
- Vishay / Semiconductor - Diodes Division
- Description:
- IGBT 600V 379A 1250W DIAP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14510 Pieces
- Data sheet:
- VS-GT300FD060N.pdf
Introduction
Specifications
| Voltage - Collector Emitter Breakdown (Max): | 600V |
|---|---|
| Vce(on) (Max) @ Vge, Ic: | 2.5V @ 15V, 300A |
| Supplier Device Package: | Dual INT-A-PAK |
| Series: | - |
| Power - Max: | 1250W |
| Package / Case: | Dual INT-A-PAK (4 + 8) |
| Other Names: | VSGT300FD060N |
| Operating Temperature: | 175°C (TJ) |
| NTC Thermistor: | No |
| Mounting Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 19 Weeks |
| Manufacturer Part Number: | VS-GT300FD060N |
| Input Capacitance (Cies) @ Vce: | 23.3nF @ 30V |
| Input: | Standard |
| IGBT Type: | Trench Field Stop |
| Expanded Description: | IGBT Module Trench Field Stop Three Level Inverter 600V 379A 1250W Chassis Mount Dual INT-A-PAK |
| Description: | IGBT 600V 379A 1250W DIAP |
| Current - Collector Cutoff (Max): | 250µA |
| Current - Collector (Ic) (Max): | 379A |
| Configuration: | Three Level Inverter |
| Email: | [email protected] |
Related parts for VS-GT300FD060N
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers