BYCHIPS is the stocking distributor for VPH2-0066-R, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for VPH2-0066-R by email, we will give you a best price according your plan.
Buy VPH2-0066-R with BYCHPS
Buy with guarantee
VPH2-0066-R
- Part Number:
- VPH2-0066-R
- Manufacturer:
- Bussmann (Eaton)
- Description:
- INDUCT ARRAY 6 COIL 6.6UH SMD
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16892 Pieces
- Data sheet:
- VPH2-0066-R.pdf
Introduction
Specifications
| Tolerance: | - |
|---|---|
| Size / Dimension: | 0.642" L x 0.661" W (16.30mm x 16.80mm) |
| Shielding: | Unshielded |
| Series: | VERSA-PAC® |
| Packaging: | Original-Reel® |
| Package / Case: | 12-SMD |
| Other Names: | 283-3670-6 |
| Operating Temperature: | -40°C ~ 85°C |
| Number of Coils: | 6 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 12 Weeks |
| Manufacturer Part Number: | VPH2-0066-R |
| Height: | 0.307" (7.80mm) |
| Expanded Description: | Unshielded Coil Inductor Array 12-SMD |
| Description: | INDUCT ARRAY 6 COIL 6.6UH SMD |
| DC Resistance (DCR) - Series: | - |
| DC Resistance (DCR) - Parallel: | - |
| Email: | [email protected] |
Related parts for VPH2-0066-R
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
CTX100-1A-R | Eaton | INDUCT ARRAY 2 COIL 99.45UH SMD | Inquiry |
 |
DRQ127-331-R | Eaton | INDUCT ARRAY 2 COIL 323.6UH SMD | Inquiry |
 |
VPH2-1600-R | Eaton | INDUCT ARRAY 6 COIL 160UH SMD | Inquiry |
|
VPH2-0216-R | Eaton | INDUCT ARRAY 6 COIL 21.6UH SMD | Inquiry |
 |
CTX5-1A-R | Eaton | INDUCT ARRAY 2 COIL 4.7UH SMD | Inquiry |
|
VPH2-0116-R | Eaton | INDUCT ARRAY 6 COIL 11.6UH SMD | Inquiry |
|
VPH2-0083-R | Eaton | INDUCT ARRAY 6 COIL 8.3UH SMD | Inquiry |
 |
CMT4545R-134M | API Delevan Inc. | INDUCT ARRAY 2 COIL 250UH SMD | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers