BYCHIPS is the stocking distributor for UVK105CG3R3JW-F, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for UVK105CG3R3JW-F by email, we will give you a best price according your plan.
Buy UVK105CG3R3JW-F with BYCHPS
Buy with guarantee
UVK105CG3R3JW-F
- Part Number:
- UVK105CG3R3JW-F
- Manufacturer:
- Taiyo Yuden
- Description:
- CAP CER 3.3PF 50V C0G 0402
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14665 Pieces
- Data sheet:
- 1.UVK105CG3R3JW-F.pdf2.UVK105CG3R3JW-F.pdf
Introduction
Specifications
| Voltage - Rated: | 50V |
|---|---|
| Tolerance: | ±5% |
| Thickness (Max): | 0.022" (0.55mm) |
| Temperature Coefficient: | C0G, NP0 |
| Size / Dimension: | 0.039" L x 0.020" W (1.00mm x 0.50mm) |
| Series: | V |
| Ratings: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 0402 (1005 Metric) |
| Other Names: | 587-5130-2 RV UVK105 CG3R3JW-F |
| Operating Temperature: | -55°C ~ 125°C |
| Mounting Type: | Surface Mount, MLCC |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 5 Weeks |
| Manufacturer Part Number: | UVK105CG3R3JW-F |
| Lead Style: | - |
| Lead Spacing: | - |
| Height - Seated (Max): | - |
| Features: | High Q, Low Loss |
| Failure Rate: | - |
| Expanded Description: | 3.3pF ±5% 50V Ceramic Capacitor C0G, NP0 0402 (1005 Metric) |
| Description: | CAP CER 3.3PF 50V C0G 0402 |
| Capacitance: | 3.3pF |
| Applications: | RF, Microwave, High Frequency |
| Email: | [email protected] |
Related parts for UVK105CG3R3JW-F
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers