BYCHIPS is the stocking distributor for USBULC6-2M6, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for USBULC6-2M6 by email, we will give you a best price according your plan.
Buy USBULC6-2M6 with BYCHPS
Buy with guarantee
USBULC6-2M6
- Part Number:
- USBULC6-2M6
- Manufacturer:
- ST
- Description:
- TVS DIODE 5VWM 17VC 6VFQFPN
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19481 Pieces
- Data sheet:
- USBULC6-2M6.pdf
Introduction
Specifications
| Voltage - Reverse Standoff (Typ): | 5V |
|---|---|
| Voltage - Clamping (Max) @ Ipp: | 17V |
| Voltage - Breakdown (Min): | 6V |
| Unidirectional Channels: | 2 |
| Type: | Steering (Rail to Rail) |
| Supplier Device Package: | 6-µQFN (1.45x1.0) |
| Series: | USB |
| Power Line Protection: | Yes |
| Power - Peak Pulse: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 6-UFDFN |
| Other Names: | 497-7044-2 USBULC62M6 |
| Operating Temperature: | - |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 9 Weeks |
| Manufacturer Part Number: | USBULC6-2M6 |
| Description: | TVS DIODE 5VWM 17VC 6VFQFPN |
| Current - Peak Pulse (10/1000µs): | 5A (8/20µs) |
| Capacitance @ Frequency: | 0.95pF @ 1MHz |
| Applications: | Ethernet |
| Email: | [email protected] |
Related parts for USBULC6-2M6
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers