BYCHIPS is the stocking distributor for UPS3100/TR13, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for UPS3100/TR13 by email, we will give you a best price according your plan.
Buy UPS3100/TR13 with BYCHPS
Buy with guarantee
UPS3100/TR13
- Part Number:
- UPS3100/TR13
- Manufacturer:
- Microsemi
- Description:
- DIODE SCHOTTKY 100V 3A POWERMITE
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 14730 Pieces
- Data sheet:
- UPS3100/TR13.pdf
Introduction
Specifications
| Voltage - Forward (Vf) (Max) @ If: | 760mV @ 3A |
|---|---|
| Voltage - DC Reverse (Vr) (Max): | 100V |
| Supplier Device Package: | Powermite |
| Speed: | Fast Recovery = 200mA (Io) |
| Series: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | DO-216AA |
| Operating Temperature - Junction: | -55°C ~ 125°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 12 Weeks |
| Manufacturer Part Number: | UPS3100/TR13 |
| Expanded Description: | Diode Schottky 100V 3A Surface Mount Powermite |
| Diode Type: | Schottky |
| Description: | DIODE SCHOTTKY 100V 3A POWERMITE |
| Current - Reverse Leakage @ Vr: | 200µA @ 100V |
| Current - Average Rectified (Io): | 3A |
| Capacitance @ Vr, F: | 85pF @ 4V, 1MHz |
| Email: | [email protected] |
Related parts for UPS3100/TR13
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers