BYCHIPS is the stocking distributor for UMZ36NT106, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for UMZ36NT106 by email, we will give you a best price according your plan.
Buy UMZ36NT106 with BYCHPS
Buy with guarantee
UMZ36NT106
- Part Number:
- UMZ36NT106
- Manufacturer:
- LAPIS Semiconductor
- Description:
- DIODE ZENER ARRAY 36V 200MW UMD3
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12918 Pieces
- Data sheet:
- UMZ36NT106.pdf
Introduction
Specifications
| Voltage - Zener (Nom) (Vz): | 36V |
|---|---|
| Voltage - Forward (Vf) (Max) @ If: | - |
| Tolerance: | - |
| Supplier Device Package: | UMD3 |
| Series: | - |
| Power - Max: | 200mW |
| Packaging: | Original-Reel® |
| Package / Case: | SC-70, SOT-323 |
| Other Names: | UMZ36NT106DKR |
| Operating Temperature: | - |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 10 Weeks |
| Manufacturer Part Number: | UMZ36NT106 |
| Expanded Description: | Zener Diode Array 1 Pair Common Anode 200mW UMD3 |
| Description: | DIODE ZENER ARRAY 36V 200MW UMD3 |
| Current - Reverse Leakage @ Vr: | - |
| Configuration: | 1 Pair Common Anode |
| Email: | [email protected] |
Related parts for UMZ36NT106
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
DZ23C4V7-G3-08 | Vishay Semiconductor Diodes Division | DIODE ZENER 4.7V 300MW SOT23 | Inquiry |
 |
MMBZ5240BS-7 | Diodes Incorporated | DIODE ZENER ARRAY 10V SOT363 | Inquiry |
|
DZ23C3V3-HE3-08 | Vishay Semiconductor Diodes Division | DIODE ZENER 3.3V 300MW SOT23 | Inquiry |
 |
PZU22DB2,115 | Nexperia USA Inc. | DIODE ZENER ARRAY 22V 5TSSOP | Inquiry |
|
AZ23C5V1-G3-18 | Vishay Semiconductor Diodes Division | DIODE ZENER 5.1V 300MW SOT23 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers