BYCHIPS is the stocking distributor for TV1625-3R0256-R, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for TV1625-3R0256-R by email, we will give you a best price according your plan.
Buy TV1625-3R0256-R with BYCHPS
Buy with guarantee
TV1625-3R0256-R
- Part Number:
- TV1625-3R0256-R
- Manufacturer:
- Bussmann (Eaton)
- Description:
- CAP, 3.0V, 25F
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13208 Pieces
- Data sheet:
- TV1625-3R0256-R.pdf
Introduction
Specifications
| Voltage - Rated: | 3V |
|---|---|
| Tolerance: | -10%, +30% |
| Termination: | PC Pins |
| Size / Dimension: | 0.650" Dia (16.50mm) |
| Series: | TV |
| Packaging: | Bulk |
| Package / Case: | Radial, Can |
| Other Names: | 283-4671 |
| Operating Temperature: | -40°C ~ 85°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 23 Weeks |
| Manufacturer Part Number: | TV1625-3R0256-R |
| Lifetime @ Temp.: | 1000 Hrs @ 85°C |
| Lead Spacing: | 0.295" (7.50mm) |
| Height - Seated (Max): | 1.122" (28.50mm) |
| Expanded Description: | 25F -10%, +30%(EDLC) Supercapacitor 3V Radial, Can 18 mOhm 1000 Hrs @ 85°C |
| ESR (Equivalent Series Resistance): | 18 mOhm |
| Description: | CAP, 3.0V, 25F |
| Capacitance: | 25F |
| Email: | [email protected] |
Related parts for TV1625-3R0256-R
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
FE0H155ZF | KEMET | CAP 1.5F -20% +80% 5.5V T/H | Inquiry |
 |
BMOD0165 P048 B09 | Maxwell Technologies Inc. | CAP 165F 48V CHASSIS MOUNT | Inquiry |
 |
B1635-2R5226 | Eaton | CAP 22F -20% +80% 2.5V T/H | Inquiry |
 |
BCAP0310 P270 T10 | Maxwell Technologies Inc. | CAP 310F 2.7V THROUGH HOLE | Inquiry |
 |
MAL219691123E3 | Vishay BC Components | CAP ALUM 4F 4.2V SNAP | Inquiry |
|
MAL219691112E3 | Vishay BC Components | CAP ALUM 4F 2.8V SNAP | Inquiry |
 |
B1010-2R5155 | Eaton | CAP 1.5F -20% +80% 2.5V T/H | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers