BYCHIPS is the stocking distributor for TSC-124L3,000, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for TSC-124L3,000 by email, we will give you a best price according your plan.
Buy TSC-124L3,000 with BYCHPS
Buy with guarantee
TSC-124L3,000
- Part Number:
- TSC-124L3,000
- Manufacturer:
- Potter & Brumfield Relays / TE Connectivity
- Description:
- RELAY TELECOM SPDT 1A 24V
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14237 Pieces
- Data sheet:
- 1.TSC-124L3,000.pdf2.TSC-124L3,000.pdf
Introduction
Specifications
| Turn On Voltage (Max): | 18 VDC |
|---|---|
| Turn Off Voltage (Min): | 1.2 VDC |
| Termination Style: | PC Pin |
| Switching Voltage: | 120VAC, 30VDC - Max |
| Series: | TSC, OEG |
| Release Time: | 5ms |
| Relay Type: | Telecom |
| Packaging: | Tube |
| Other Names: | 2-1419130-7 |
| Operating Temperature: | -30°C ~ 80°C |
| Operate Time: | 5ms |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 17 Weeks |
| Manufacturer Part Number: | TSC-124L3,000 |
| Features: | Sealed - Flux Protection |
| Expanded Description: | Telecom Relay SPDT (1 Form C) Through Hole |
| Description: | RELAY TELECOM SPDT 1A 24V |
| Contact Rating (Current): | 1A |
| Contact Material: | Silver Nickel (AgNi) |
| Contact Form: | SPDT (1 Form C) |
| Coil Voltage: | 24VDC |
| Coil Type: | Non Latching |
| Coil Resistance: | 3.84 kOhms |
| Coil Power: | 150 mW |
| Coil Current: | 6.3mA |
| Email: | [email protected] |
Related parts for TSC-124L3,000
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers