BYCHIPS is the stocking distributor for TMPM369FDFG, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for TMPM369FDFG by email, we will give you a best price according your plan.
Buy TMPM369FDFG with BYCHPS
Buy with guarantee
TMPM369FDFG
- Part Number:
- TMPM369FDFG
- Manufacturer:
- Toshiba Semiconductor
- Description:
- IC MCU 32BIT 512KB FLASH 144LQFP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19523 Pieces
- Data sheet:
- TMPM369FDFG.pdf
Introduction
Specifications
| Voltage - Supply (Vcc/Vdd): | 2.7 V ~ 3.6 V |
|---|---|
| Supplier Device Package: | 144-LQFP (20x20) |
| Speed: | 80MHz |
| Series: | TX03 |
| RAM Size: | 128K x 8 |
| Program Memory Type: | FLASH |
| Program Memory Size: | 512KB (512K x 8) |
| Peripherals: | DMA, POR, WDT |
| Packaging: | Tray |
| Package / Case: | 144-QFP |
| Oscillator Type: | Internal |
| Operating Temperature: | -40°C ~ 85°C (TA) |
| Number of I/O: | 102 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 18 Weeks |
| Manufacturer Part Number: | TMPM369FDFG |
| Expanded Description: | ARM® Cortex®-M3 TX03 Microcontroller IC 32-Bit 80MHz 512KB (512K x 8) FLASH 144-LQFP (20x20) |
| EEPROM Size: | - |
| Description: | IC MCU 32BIT 512KB FLASH 144LQFP |
| Data Converters: | A/D 16x12b, D/A 2x10b |
| Core Size: | 32-Bit |
| Core Processor: | ARM® Cortex®-M3 |
| Connectivity: | CAN, EBI/EMI, Ethernet, I²C, Microwire, SIO, SPI, SSP, UART/USART, USB |
| Email: | [email protected] |
Related parts for TMPM369FDFG
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers