BYCHIPS is the stocking distributor for TE0715-04-30-1I3, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for TE0715-04-30-1I3 by email, we will give you a best price according your plan.
Buy TE0715-04-30-1I3 with BYCHPS
Buy with guarantee
TE0715-04-30-1I3
- Part Number:
- TE0715-04-30-1I3
- Manufacturer:
- Trenz Electronic
- Description:
- XILINX ZYNQ Z-7030 SOC MICROMODU
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15974 Pieces
- Data sheet:
- 1.TE0715-04-30-1I3.pdf2.TE0715-04-30-1I3.pdf
Introduction
Specifications
| Speed: | 125MHz |
|---|---|
| Size / Dimension: | 1.97" x 1.57" (50mm x 40mm) |
| Series: | TE071x |
| RAM Size: | 1GB |
| Operating Temperature: | - |
| Module/Board Type: | MCU, FPGA |
| Manufacturer Standard Lead Time: | 12 Weeks |
| Manufacturer Part Number: | TE0715-04-30-1I3 |
| Flash Size: | 32MB |
| Expanded Description: | TE071x Embedded Module ARM Cortex-A9 Zynq-7000 (Z-7030) 125MHz 1GB 32MB |
| Description: | XILINX ZYNQ Z-7030 SOC MICROMODU |
| Core Processor: | ARM Cortex-A9 |
| Connector Type: | Samtec LSHM |
| Co-Processor: | Zynq-7000 (Z-7030) |
| Email: | [email protected] |
Related parts for TE0715-04-30-1I3
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers