BYCHIPS is the stocking distributor for TDA1308AT/N2,115, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for TDA1308AT/N2,115 by email, we will give you a best price according your plan.
Buy TDA1308AT/N2,115 with BYCHPS
Buy with guarantee
TDA1308AT/N2,115
- Part Number:
- TDA1308AT/N2,115
- Manufacturer:
- NXP Semiconductors / Freescale
- Description:
- IC AMP AUDIO .08W STER AB 8SOIC
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12071 Pieces
- Data sheet:
- TDA1308AT/N2,115.pdf
Introduction
Specifications
| Voltage - Supply: | 2.4 V ~ 7 V, ±1.2 V ~ 3.5 V |
|---|---|
| Type: | Class AB |
| Supplier Device Package: | 8-SO |
| Series: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 8-SOIC (0.154", 3.90mm Width) |
| Output Type: | Headphones, 2-Channel (Stereo) |
| Other Names: | 568-3498-2 935273873115 TDA1308AT/N2-G |
| Operating Temperature: | -40°C ~ 85°C (TA) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Max Output Power x Channels @ Load: | 80mW x 2 @ 32 Ohm |
| Manufacturer Part Number: | TDA1308AT/N2,115 |
| Features: | Depop, Short-Circuit Protection |
| Expanded Description: | Amplifier IC Headphones, 2-Channel (Stereo) Class AB 8-SO |
| Description: | IC AMP AUDIO .08W STER AB 8SOIC |
| Email: | [email protected] |
Related parts for TDA1308AT/N2,115
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
TDA1308/N2,112 | NXP USA Inc. | IC AMP AUDIO 3W STER AB 8DIP | Inquiry |
 |
TDA1308T/N2,112 | NXP USA Inc. | IC AMP AUDIO .08W STER AB 8SOIC | Inquiry |
 |
TDA1308TT/N2,118 | NXP USA Inc. | IC AMP AUDIO .08W STER AB 8TSSOP | Inquiry |
 |
TDA1308AUK,027 | NXP USA Inc. | IC AMP AUDIO .08W STER AB 8WLCSP | Inquiry |
|
TDA1308T/N2,115 | NXP USA Inc. | IC AMP AUDIO 3W STER AB 8SOIC | Inquiry |
|
TDA1308T/N1,112 | NXP USA Inc. | IC AMP AUDIO .08W STER AB 8SOIC | Inquiry |
|
TDA1308AT/N2,112 | NXP USA Inc. | IC AMP AUDIO 3W STER AB 8SOIC | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers