BYCHIPS is the stocking distributor for T92S11D12-110, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for T92S11D12-110 by email, we will give you a best price according your plan.
Buy T92S11D12-110 with BYCHPS
Buy with guarantee
T92S11D12-110
- Part Number:
- T92S11D12-110
- Manufacturer:
- Potter & Brumfield Relays / TE Connectivity
- Description:
- RELAY GEN PURPOSE DPDT 30A 110V
- Lead Free Status / RoHS Status:
- Contains lead / RoHS Compliant
- Available Quantity:
- 16928 Pieces
- Data sheet:
- T92S11D12-110.pdf
Introduction
Specifications
| Turn On Voltage (Max): | 82.5 VDC |
|---|---|
| Turn Off Voltage (Min): | 11 VDC |
| Termination Style: | PC Pin |
| Switching Voltage: | 277VAC, 28VDC - Max |
| Series: | T92 |
| Release Time: | 15ms |
| Relay Type: | General Purpose |
| Packaging: | Bulk |
| Other Names: | 8-1393211-8 PB1010 T92S11D12110 |
| Operating Temperature: | -55°C ~ 85°C |
| Operate Time: | 15ms |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 21 Weeks |
| Manufacturer Part Number: | T92S11D12-110 |
| Features: | Insulation - Class F, Sealed - Fully |
| Expanded Description: | General Purpose Relay DPDT (2 Form C) 110VDC Coil Through Hole |
| Description: | RELAY GEN PURPOSE DPDT 30A 110V |
| Contact Rating (Current): | 30A |
| Contact Material: | Silver Cadmium Oxide (AgCdO) |
| Contact Form: | DPDT (2 Form C) |
| Coil Voltage: | 110VDC |
| Coil Type: | Non Latching |
| Coil Resistance: | 7.25 kOhms |
| Coil Power: | 1.7 W |
| Coil Current: | 15.45mA |
| Email: | [email protected] |
Related parts for T92S11D12-110
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers