BYCHIPS is the stocking distributor for T55T226M010C0200, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for T55T226M010C0200 by email, we will give you a best price according your plan.
Buy T55T226M010C0200 with BYCHPS
Buy with guarantee
T55T226M010C0200
- Part Number:
- T55T226M010C0200
- Manufacturer:
- Vishay / Sprague
- Description:
- CAP TANT POLY 22UF 10V 1411
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12919 Pieces
Introduction
Specifications
| Voltage - Rated: | 10V |
|---|---|
| Type: | Molded |
| Tolerance: | ±20% |
| Size / Dimension: | 0.138" L x 0.110" W (3.50mm x 2.80mm) |
| Series: | vPolyTan™ T55 |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 1411 (3528 Metric) |
| Other Names: | 718-2076-2 |
| Operating Temperature: | -55°C ~ 105°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 18 Weeks |
| Manufacturer Size Code: | T |
| Manufacturer Part Number: | T55T226M010C0200 |
| Lifetime @ Temp.: | - |
| Lead Spacing: | - |
| Height - Seated (Max): | 0.047" (1.20mm) |
| Features: | General Purpose |
| Expanded Description: | 22µF ±20% Molded Tantalum Polymer Capacitor 10V 1411 (3528 Metric) 200 mOhm |
| ESR (Equivalent Series Resistance): | 200 mOhm |
| Description: | CAP TANT POLY 22UF 10V 1411 |
| Capacitance: | 22µF |
| Email: | [email protected] |
Related parts for T55T226M010C0200
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
T55T226M010C0070 | Vishay Sprague | CAP TANT POLY 22UF 10V 1411 | Inquiry |
|
T55T226M010C0150 | Vishay Sprague | CAP TANT POLY 22UF 10V 1411 | Inquiry |
|
T55T226M6R3C0150 | Vishay Sprague | CAP TANT POLY 22UF 6.3V 1411 | Inquiry |
|
T55T226M6R3C0070 | Vishay Sprague | CAP TANT POLY 22UF 6.3V 1411 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers