BYCHIPS is the stocking distributor for T498C226K016ATZB12, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for T498C226K016ATZB12 by email, we will give you a best price according your plan.
Buy T498C226K016ATZB12 with BYCHPS
Buy with guarantee
T498C226K016ATZB12
- Part Number:
- T498C226K016ATZB12
- Manufacturer:
- KEMET
- Description:
- CAP TANT SMD
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15637 Pieces
- Data sheet:
- T498C226K016ATZB12.pdf
Introduction
Specifications
| Voltage - Rated: | 16V |
|---|---|
| Type: | Molded |
| Tolerance: | ±10% |
| Size / Dimension: | 0.236" L x 0.126" W (6.00mm x 3.20mm) |
| Series: | T498 |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 2312 (6032 Metric) |
| Operating Temperature: | -55°C ~ 150°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 17 Weeks |
| Manufacturer Size Code: | C |
| Manufacturer Part Number: | T498C226K016ATZB12 |
| Lifetime @ Temp.: | 2000 Hrs @ 150°C |
| Lead Spacing: | - |
| Height - Seated (Max): | 0.110" (2.80mm) |
| Features: | General Purpose |
| Failure Rate: | - |
| Expanded Description: | 22µF ±10% Molded Tantalum Capacitors 16V 2312 (6032 Metric) |
| ESR (Equivalent Series Resistance): | - |
| Description: | CAP TANT SMD |
| Capacitance: | 22µF |
| Email: | [email protected] |
Related parts for T498C226K016ATZB12
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
T498C226K016ATE1K0 | KEMET | CAP TANT 22UF 16V 10% 2312 | Inquiry |
|
T498C226K016ZTZB12 | KEMET | CAP TANT 22UF 16V 10% 2312 | Inquiry |
|
T498C225K035ZTE2K2 | KEMET | CAP TANT 2.2UF 35V 10% 2312 | Inquiry |
|
T498C226K016ZTE1K0 | KEMET | CAP TANT 22UF 16V 10% 2312 | Inquiry |
|
T498C225K035ATE2K2 | KEMET | CAP TANT 2.2UF 35V 10% 6032-28 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers