BYCHIPS is the stocking distributor for T322C475K035AS, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for T322C475K035AS by email, we will give you a best price according your plan.
Buy T322C475K035AS with BYCHPS
Buy with guarantee
T322C475K035AS
- Part Number:
- T322C475K035AS
- Manufacturer:
- KEMET
- Description:
- CAP TANT 4.7UF 35V 10% AXIAL
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 19654 Pieces
- Data sheet:
- T322C475K035AS.pdf
Introduction
Specifications
| Voltage - Rated: | 35V |
|---|---|
| Type: | Molded |
| Tolerance: | ±10% |
| Size / Dimension: | 0.180" Dia x 0.345" L (4.57mm x 8.76mm) |
| Series: | T322 |
| Packaging: | Bulk |
| Package / Case: | Axial |
| Other Names: | 399-1527 |
| Operating Temperature: | -55°C ~ 125°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 8 Weeks |
| Manufacturer Size Code: | C |
| Manufacturer Part Number: | T322C475K035AS |
| Lifetime @ Temp.: | - |
| Lead Spacing: | - |
| Height - Seated (Max): | - |
| Features: | General Purpose |
| Failure Rate: | - |
| Expanded Description: | 4.7µF ±10% Molded Tantalum Capacitors 35V Axial 3 Ohm |
| ESR (Equivalent Series Resistance): | 3 Ohm |
| Description: | CAP TANT 4.7UF 35V 10% AXIAL |
| Capacitance: | 4.7µF |
| Email: | [email protected] |
Related parts for T322C475K035AS
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
T322C475J035AT | KEMET | CAP TANT 4.7UF 5% 35V AXIAL | Inquiry |
|
T322C475K035AT | KEMET | CAP TANT 4.7UF 35V 10% AXIAL | Inquiry |
|
T322C156K015AT | KEMET | CAP TANT 15UF 15V 10% AXIAL | Inquiry |
|
T322C475K025AT | KEMET | CAP TANT 4.7UF 25V 10% AXIAL | Inquiry |
|
T322C475K025AS | KEMET | CAP TANT 4.7UF 25V 10% AXIAL | Inquiry |
|
T322C226K006AT | KEMET | CAP TANT 22UF 6V 10% AXIAL | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers