BYCHIPS is the stocking distributor for STGB3NB60SDT4, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for STGB3NB60SDT4 by email, we will give you a best price according your plan.
Buy STGB3NB60SDT4 with BYCHPS
Buy with guarantee
STGB3NB60SDT4
- Part Number:
- STGB3NB60SDT4
- Manufacturer:
- ST
- Description:
- IGBT 600V 6A 70W D2PAK
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19518 Pieces
- Data sheet:
- STGB3NB60SDT4.pdf
Introduction
Specifications
| Voltage - Collector Emitter Breakdown (Max): | 600V |
|---|---|
| Vce(on) (Max) @ Vge, Ic: | 1.5V @ 15V, 3A |
| Test Condition: | 480V, 3A, 1 kOhm, 15V |
| Td (on/off) @ 25°C: | 125ns/3.4µs |
| Switching Energy: | 1.15mJ (off) |
| Supplier Device Package: | D2PAK |
| Series: | PowerMESH™ |
| Reverse Recovery Time (trr): | 1.7µs |
| Power - Max: | 70W |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Operating Temperature: | 175°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | STGB3NB60SDT4 |
| Input Type: | Standard |
| IGBT Type: | - |
| Gate Charge: | 18nC |
| Expanded Description: | IGBT 600V 6A 70W Surface Mount D2PAK |
| Description: | IGBT 600V 6A 70W D2PAK |
| Current - Collector Pulsed (Icm): | 25A |
| Current - Collector (Ic) (Max): | 6A |
| Email: | [email protected] |
Related parts for STGB3NB60SDT4
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog