BYCHIPS is the stocking distributor for SPAKDSP303AG100, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for SPAKDSP303AG100 by email, we will give you a best price according your plan.
Buy SPAKDSP303AG100 with BYCHPS
Buy with guarantee
SPAKDSP303AG100
- Part Number:
- SPAKDSP303AG100
- Manufacturer:
- NXP Semiconductors / Freescale
- Description:
- IC DSP 24BIT 100MHZ 144-LQFP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17037 Pieces
- Data sheet:
- 1.SPAKDSP303AG100.pdf2.SPAKDSP303AG100.pdf
Introduction
Specifications
| Voltage - I/O: | 3.30V |
|---|---|
| Voltage - Core: | 3.30V |
| Type: | Fixed Point |
| Supplier Device Package: | 144-LQFP (20x20) |
| Series: | DSP563xx |
| Packaging: | Tray |
| Package / Case: | 144-LQFP |
| Operating Temperature: | -40°C ~ 105°C (TJ) |
| On-Chip RAM: | 24kB |
| Non-Volatile Memory: | ROM (576 B) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Part Number: | SPAKDSP303AG100 |
| Interface: | Host Interface, SSI, SCI |
| Description: | IC DSP 24BIT 100MHZ 144-LQFP |
| Clock Rate: | 100MHz |
| Email: | [email protected] |
Related parts for SPAKDSP303AG100
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
SPAKDSP321VF240 | NXP USA Inc. | IC DSP 24BIT 196-MAPBGA | Inquiry |
|
SPAKDSP303VL100 | NXP USA Inc. | IC DSP 24BIT 100MHZ 196-MAPBGA | Inquiry |
|
SPAKDSP311VL150 | NXP USA Inc. | IC DSP 24BIT 150MHZ 196-MAPBGA | Inquiry |
|
SPAKDSP321VL240 | NXP USA Inc. | IC DSP 24BIT 240MHZ 196-MAPBGA | Inquiry |
|
SPAKDSP311VF150 | NXP USA Inc. | IC DSP 24BIT 196-MAPBGA | Inquiry |
|
SPAKDSP303VF100 | NXP USA Inc. | IC DSP 24BIT 100MHZ 196-MAPBGA | Inquiry |
|
SPAKDSP321VL275 | NXP USA Inc. | IC DSP 24BIT 275MHZ 196-MAPBGA | Inquiry |
|
SPAKDSP321VF275 | NXP USA Inc. | IC DSP 24BIT 196-MAPBGA | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers